Metallum Foils

Metallum Foils

 

Soluciones provectus Superficies Curatio Metallica- Polymerus Laminates & Decorative Packaging

Plasma levantes activum, functionis chemicae, et technologiae nanoscales et technologiae nanoscales, nos curationes superficiei fectum ad vires vinculi criticas assequendas in:

Obice packaging - Praeveni electrolyticum- deleminationem in aluminium induxisse- polymerorum altilium manticae (eg, Li-ion cell encapsulation)

Decorative Foils - augendae metallized charta adhaesio ad luxuriam flexibile packaging sine vitiis

Functional Laminates - Optimise interpositae multi- structurae materiales compages (exempli gratia Al/Gf/PP composita pro autocinetis)

Solve Caput Industry

application

   

Foil Packaging altilium

Electrolytus penetratio → Metallum corrosio & polymer delaminatio

Chromate- anodization gratis + hydrophobic polymerorum obsignatio

Decorative Metallized Films

Humilis superficies energia PP/PE subiecta → Coating decorticare

Plasma atmosphaerica insitionis globuli carbonyl polaris

Fibra Metal Laminates (FMLs)

Infirmi mechanica interlocking apud Al / CFRP interface

Micro- arcus oxidationis (MAO) poros hierarchicos creans

 

 
 
Technical differentiatio

Environmentally- Processus sustinebiles

Repone conversionem chromatis carcinogenicum cum sol- gel coatings vel acidum phosphoricum anodization.

VOC emissiones nullas consequi curatione plasmate sicco utentes vs. solvendo{1}} ex primers

 

Subtilitas Superficiem Engineering

Imperium asperitas in 0.1-5μm scala pro statio mechanica (mechanica abrasione)

Genera chemicae compages sites (-OH, {{1} COOH) per plasma oxidationis oxygenii

Industria- Specifica Validation

Cibus packaging: Transi FDA migratio probat ad directum- cibum- contactum laminarum

Pugna Encapsulation: XL% altius cortices vires vs. increatum rudibus in LXXXV gradu electrolytici

 

Engineer- exsequendam Backed

▶︎ Material Diagnostics: XPS / SEM analysis de defectu interfaces (eg, iacuit oxydatum integritas compescit)

Processus Integration: Retrofit lamination existentium lineae cum inline plasma systems

▶︎ Praestare: Vinculum vires Maior quam vel aequalis ad 8 N/cm pro charta metallica- PET laminarum