Typis Electronics
Subtilitas Plasma Superficies Curatio pro Typis Electronics & Flexibiles Fabrica
Provectus plasma superficiei curatio idoneum adhaesionem amplificationem praebet in subiectis sensitivo adhibitis:
- Flexibile Circuitus Typis (FPCs)- polyimide activum (PI) et PET cinematographica ad atramentum conductivum
- OLED/LCD Propono - Pre-laminationem curationis ultra- vitri tenue (UTFG) et ITO tunicas
- Tenues- membranae membranae - Superficies functionis Li-ion electrodis rudibus
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Provocare |
Plasma SOLUTIO |
Technical Beneficium |
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Humilis superficiei industria polymerorum |
Oxygen/Argon/plasma hydroxylum (-OH) & carboxylum (-COOH) coetus inducit |
Contactus angulus reductionem ex 80 gradu → 30 gradus in<1s |
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Dimitte- materias sensitivas |
Pulsus DBD plasma at<50°C prevents thermal damage |
Nanoscale modificatio (<10nm depth) only |
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Adhaesio defectum in UTFG |
DCSBD plasma hydrocarbonum removet cum addit oxygeni functionalities |
10⁵× resistivity deminuto in rGO circuitus |
Materia-Protocolla Imprimis
- Polyimide Films (Kapton®)
Processus: N₂/H₂ plasma apud 20kHz, 7kV
Consequuntur: 60% atramenti superioris adhaesio vs. coronae curatio
- Ultra- Vitreum tenue (UTFG)
Processus: Diffunde Coplanar Superficiem Obex dimissionem (DCSBD)
Consequuntur: 40% conductivity incremento PEDOT: PSS coatings
- Li-ion Electrode Foils
Process: plasma atmosphaericum cum He/O₂ mix
Consequuntur: XV% cortices superiores vires in cellulis laminated
- Ingeniarius- Paratus solutiones ad solvendas-Materias sensitivas
Nostrae systemata integrant realem- temporis impedimentum vigilantia et adaptivam potestatem ad arcendam in arcendo vim prohibendam:
Temperatura- bio sensitivo- polymerorum (eg, scaemata PLGA)
Micro- formata ITO superficierum
Rara altilium separatores
- Contact Our Superface Engineering Team For:
Material convenientiam probatio fama (incl. WCA/SEM/XPS data)
processus sanatio cum subiectorum tuorum (PI/COP/PEN)
▶︎ Ad-site parametri optimizationem ne detrimentum ferat